Current Exemptions to RoHS

(including exemption additions currently in a draft stage):

*Mercury in compact fluorescent lamps not exceeding 5mg per lamp

*Mercury in straight fluorescent lamps for general purposes not exceeding 10mg of halophosphate, 5mg of triphosphate with normal lifetime and 8mg of triphosphate with long lifetime

*Mercury in straight fluorescent lamps for special purposes

*Mercury in other lamps not specifically mentioned in the annex

*Lead in glass of cathode ray tubes, electronic components and fluorescent tubes

*Lead as an alloying element in steel containing up to 0.35 per cent lead by weight, aluminium containing up to 0.4 per cent lead by weight and as a copper alloy containing up to four per cent lead by weight

*Lead in high melting temperature type solders (i.e. lead based alloys containing 85 per cent by weight or more lead). This includes: lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications; lead in electronic ceramic parts (e.g. piezoelectronic devices)

*Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338EEC amending Directive 76/769EEC

*Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators

*Lead in compliant pin connector systems

*Lead as a coating material for the thermal conduction module e-ring

*Lead and cadmium in optical and filter glass

*Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 per cent and less than 85 per cent by weight

*Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated Flip Chip packages