Hot-Air Levelling Flux for Lead-Free PCB Solder Finishing

"AMI DODUCO, a Technitrol Company, offers the printed circuit board (PCB) industry a new flux material for hot-air levelling using lead-free solders. Hot-air levelling of tin/lead solder is the traditional surface finish for PCBs, but effective July 1, 2006, the European Union's Restriction of Hazardous Substances (RoHS) Directive will prohibit the use of lead in electrical and electronic appliances throughout the European Union. Solders containing lead must be replaced by lead-free alternatives such as tin/copper/nickel alloys. These solders, however, require a higher working temperature than conventional tin/lead materials." Source: BusinessWire