Lead-free Wafer Bumping Service

"IC Interconnect, a wafer bumping service company, announces its lead-free bumping capabilities, available now as a standard service offering. Reducing harmful substances in the environment at the manufacturing source has become increasingly important. Current RoHS (Restrictions on Hazardous Substances) initiatives mandate that by July 1, 2006, all new electronic equipment put on the market in European Union member states shall not contain lead, mercury, cadmium or hexavalent chromium. The United States does not currently have any guidelines, but will be affected by global manufacturers making the lead-free transition." Source: smt.pennnet.com