Indium Corporation to feature WEEE/RoHS compliant materials at Productronica

"Indium Corporation will be exhibiting its Suite of Pb-Free Electronics Assembly Materials for WEEE and RoHS compliance at the Productronica show in Munich, Germany on November 15-18, 2006. Indium will be located in booth A3-550. Indium's exhibit will offer a full range of Pb-Free assembly materials, including the first Reworkable Pb-Free No-Flow Underfill (NF-260) and its newest No-Clean Solder Paste (Indium5.1) with its industry leading response-to-pause printing. In addition, Indium will also feature other Pb-Free materials, such as Water-Wash Solder Pastes (Indium3.1), Solder Preforms in Tape & Reel Packaging, Wave Solder Flux for Pb-Free mixed-technology, and Rework & Repair materials." Source: emsnow.com